HS-QSFP-P1-02-LP
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28814859-HS-QSFP-P1-02-LP
HEAT SINK FLYOVER 6.5MM
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
a group of products which fulfill a similar need for a market segment or market as a whole.
a particular group of related products.
Quantity
Unit Price
Ext. Price
1+
$543.065228
$543.03
10+
$512.325649
$5,123.20
100+
$483.326130
$48,332.57
500+
$455.968029
$227,984.01
1000+
$430.158522
$430,158.53
* The above prices does not include taxes and freight rates, which will be calculated on the order pages.