HS-QSFP-P1-02-LP
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28814859-HS-QSFP-P1-02-LP
HEAT SINK FLYOVER 6.5MM
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
a group of products which fulfill a similar need for a market segment or market as a whole.
a particular group of related products.
Quantity
Unit Price
Ext. Price
1+
$553.760995
$553.76
10+
$522.416032
$5,224.15
100+
$492.845340
$49,284.59
500+
$464.948398
$232,474.15
1000+
$438.630583
$438,630.58
* The above prices does not include taxes and freight rates, which will be calculated on the order pages.