Samsung Semiconductor SPMWH12244D7W8WMSA

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8541.41.00.00

Category

Chip LED

Lens Shape Type

Rectangular

Mounting Orientation

Top Mount

Viewing Angle (°)

120

Maximum Forward Current (mA)

45

Test Current (mA)

40

Maximum Forward Voltage (V)

20

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

80

Color Temperature

the temperature at which a black body would emit radiation of the same color as a given object.

2700K

Lead Standoff

No

High Power

No

High Brightness

No

Mounting

Surface Mount

Package Height

0.65

Package Width

2.8

Package Length

3.2

PCB changed

2

Operating Temperature Classification

Commercial

Product Depth (mm)

2.8(mm)

Dominant Wave Length

Not Required(nm)

Maximum Forward Current

45(mA)

Operating Temp Range

-40C to 80C

Rad Hardened

No

Shape Type

Rectangular

Test Current (It)

40(mA)

Main Category

Chip LED

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Unconfirmed

Type

Uni-Color

Color

White

Pin Count

a count of all of the component leads (or pins)

2

Viewing Angle

the angle at which a display can be viewed with acceptable visual performance.

120(deg)

Forward Current

Current which flows upon application of forward voltage.

45(mA)

Forward Voltage

the amount of voltage needed to get current to flow across a diode.

20(V)

Luminous Flux

the measure of the perceived power of light.

85lm

Peak Wavelength

Not Required(nm)

Product Length (mm)

3.2(mm)

Product Height (mm)

0.65(mm)