Samsung Semiconductor SPHWHTL3D305E6V0F5

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8541.41.00.00

Automotive

No

PPAP

No

Category

Chip LED

Lens Shape Type

Circular

Lens Dimensions (mm)

2.69x2.69x0.73

Mounting Orientation

Top Mount

Viewing Angle (°)

125

Maximum Forward Current (mA)

1500

Test Current (mA)

1500

Maximum Forward Voltage (V)

3.34(Typ)

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Color Temperature

the temperature at which a black body would emit radiation of the same color as a given object.

3000K

Lead Standoff

No

Supplier Color

White

Color Rendering Index

80

High Power

Yes

High Brightness

Yes

Mounting

Surface Mount

Package Width

3.5

Package Length

3.5

PCB changed

2

Standard Package Name

SMD

Supplier Package

CSMD

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Unconfirmed

Type

Uni-Color

Color

White

Pin Count

a count of all of the component leads (or pins)

2

Luminous Flux

the measure of the perceived power of light.

301lm(Min)

Number of LEDs

1