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M395T2863QZ4-CE66

Samsung Semiconductor M395T2863QZ4-CE66

Part No:

M395T2863QZ4-CE66

Manufacturer:

Samsung Semiconductor

Datasheet:

Package:

-

AINNX NO:

32031203-M395T2863QZ4-CE66

Category:

Memory - Modules

Description:

Products specifications

EU RoHS
Compliant
ECCN (US)
EAR99
Automotive
No
PPAP
No
Module
DRAM Module
Module Density
1Gbyte
Number of Chip per Module
9
Chip Density (bit)
1G
Data Bus Width (bit)
72
Maximum Clock Rate (MHz)
667
Chip Configuration
128Mx8
Chip Package Type
FBGA
Minimum Operating Supply Voltage (V)
1.7
Typical Operating Supply Voltage (V)
1.8
Maximum Operating Supply Voltage (V)
1.9
Minimum Operating Temperature (°C)
0
Maximum Operating Temperature (°C)
85
Module Sides
Double
ECC Support
Yes
Number of Ranks
Single
Number of Chip Banks
8
CAS Latency
5
PC Type
PC2-5300
SPD EEPROM Support
Yes
Mounting
Socket
Package Height
30.35
Package Width
8.2(Max)
Package Length
133.35
PCB changed
240
Supplier Package
FBDIMM
Lead Shape
No Lead
Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Obsolete
Pin Count
a count of all of the component leads (or pins)
240
Organization
128Mx72
PLL
Yes
Self Refresh
Yes
Module Type
240FBDIMM

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