Samsung Semiconductor M378B1G73QH0-CK0

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Terminals

240

EU RoHS

Compliant

ECCN (US)

4A994.a

Automotive

No

PPAP

No

Module

DRAM Module

Module Density

8Gbyte

Number of Chip per Module

16

Chip Density (bit)

4G

Data Bus Width (bit)

64

Max. Access Time (ns)

0.225

Maximum Clock Rate (MHz)

1600

Chip Configuration

512Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Operating Current (mA)

1040

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Module Sides

Double

ECC Support

No

Number of Ranks

Dual

Number of Chip Banks

8

CAS Latency

11

SPD EEPROM Support

Yes

Mounting

Socket

Package Height

30

Package Width

4(Max)

Package Length

133.35

PCB changed

240

Supplier Package

UDIMM

Lead Shape

No Lead

Package Description

DIMM,

Package Style

MICROELECTRONIC ASSEMBLY

Number of Words Code

1000000000

Package Body Material

UNSPECIFIED

Operating Temperature-Max

85 °C

Manufacturer Part Number

M378B1G73QH0-CK0

Number of Words

1073741824 words

Supply Voltage-Nom (Vsup)

1.5 V

Package Code

DIMM

Package Shape

RECTANGULAR

Manufacturer

Samsung Semiconductor

Part Life Cycle Code

Active

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Risk Rank

5.67

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

AUTO/SELF REFRESH; WD-MAX

Technology

CMOS

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

NO LEAD

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

1 mm

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

240

JESD-30 Code

R-XDMA-N240

Supply Voltage-Max (Vsup)

1.575 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

Supply Voltage-Min (Vsup)

1.425 V

Number of Ports

A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

1

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

SYNCHRONOUS

Organization

1Gx64

Seated Height-Max

30.15 mm

Memory Width

64

Memory Density

68719476736 bit

PLL

No

Memory IC Type

DDR DRAM MODULE

Access Mode

Distinct operation recognized by the protection mechanisms as a possible operation on an object.

DUAL BANK PAGE BURST

Self Refresh

Yes

Module Type

240UDIMM

Width

4 mm

Length

133.35 mm