Samsung Semiconductor KLMCG4JETD-B0410

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

153

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

HTS

8542.32.00.71

Automotive

No

PPAP

No

Cell Type

NAND

Chip Density (bit)

512G

Number of Bits/Word (bit)

1/4/8

Number of Words

512G/128G/64G

Programmability

Yes

Timing Type

Synchronous

Maximum Erase Time (S)

0.02

Interface Type

Serial e-MMC

Minimum Operating Supply Voltage (V)

1.7|2.7

Maximum Operating Frequency (MHz)

200

Typical Operating Supply Voltage (V)

1.8|3.3

Maximum Operating Supply Voltage (V)

1.95|3.6

Minimum Operating Temperature (°C)

-25

Maximum Operating Temperature (°C)

85

Command Compatible

Yes

ECC Support

Yes

Support of Page Mode

No

Mounting

Surface Mount

Package Height

0.71

Package Width

11.5

Package Length

13

PCB changed

153

Standard Package Name

BGA

Supplier Package

FBGA

Lead Shape

Ball

Package Description

VFBGA,

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Number of Words Code

64000000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-25 °C

Operating Temperature-Max

85 °C

Manufacturer Part Number

KLMCG4JETD-B0410

Clock Frequency-Max (fCLK)

200 MHz

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

VFBGA

Package Shape

RECTANGULAR

Manufacturer

Samsung Semiconductor

Part Life Cycle Code

Active

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Risk Rank

5.79

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

MLC NAND TYPE

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

ALSO OPERATES @ 3V SUP NOM

Technology

CMOS

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.5 mm

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

153

JESD-30 Code

R-PBGA-B153

Supply Voltage-Max (Vsup)

1.95 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

Supply Voltage-Min (Vsup)

1.7 V

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

SYNCHRONOUS

Organization

64GX8

Seated Height-Max

1 mm

Memory Width

8

Memory Density

549755813888 bit

Parallel/Serial

PARALLEL

Memory IC Type

FLASH

Programming Voltage

A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

1.8 V

Boot Block

Yes

Width

11.5 mm

Length

13 mm