Samsung Semiconductor K9F2808U0C-YCB000

EU RoHS

Not Compliant

ECCN (US)

3A991.b.1.a

Automotive

No

PPAP

No

Cell Type

SLC NAND

Chip Density (bit)

128M

Block Organization

Symmetrical

Address Bus Width (bit)

24

Number of Bits/Word (bit)

8

Number of Words

16M

Programmability

Yes

Timing Type

Asynchronous

Maximum Erase Time (S)

0.003/Block

Maximum Page Access Time (ns)

50(Min)

Maximum Programming Time (ms)

0.5/Chip

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

20

Program Current (mA)

20

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

Command Compatible

No

ECC Support

Yes

Support of Page Mode

Yes

Mounting

Surface Mount

Package Height

1

Package Width

18.4

Package Length

12

PCB changed

48

Standard Package Name

SOP

Supplier Package

TSOP-I

Lead Shape

Gull-wing

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

48

Architecture

Sectored

Sector Size

16Kbyte x 1024

Page Size

512byte

Boot Block

No