Samsung Semiconductor K8Q2815UQB-PI4B000

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

HTS

8542.32.00.71

Automotive

No

PPAP

No

Cell Type

NOR

Chip Density (bit)

128M

Block Organization

Asymmetrical

Location of Boot Block

Top|Bottom

Address Bus Width (bit)

23

Bank Size

8/8/8/8/24/24/24/24Mb

Number of Bits/Word (bit)

16

Number of Words

8M

Programmability

Yes

Timing Type

Asynchronous

Max. Access Time (ns)

60

Maximum Erase Time (S)

113.6/Chip

Maximum Page Access Time (ns)

25

Maximum Programming Time (ms)

5040/Chip

OE Access Time (ns)

25

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3.3|3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.7 to 3.6

Operating Current (mA)

55

Page Read Current (mA)

22

Program Current (mA)

30

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

No

ECC Support

No

Support of Page Mode

Yes

Mounting

Surface Mount

Package Height

1

Package Width

18.8

Package Length

14

PCB changed

56

Standard Package Name

SOP

Supplier Package

TSOP

Lead Shape

Gull-wing

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

56

Architecture

Sectored

Sector Size

64Kbyte x 252|8Kbyte x 32

Page Size

8Words

Boot Block

Yes

Number of Banks

8