Samsung Semiconductor K8P6415UQB-DI4BT

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

Automotive

No

PPAP

No

Cell Type

NOR

Chip Density (bit)

64M

Block Organization

Asymmetrical

Location of Boot Block

Bottom|Top

Address Bus Width (bit)

22

Bank Size

8/8/24/24Mb

Number of Bits/Word (bit)

16

Number of Words

4M

Programmability

Yes

Timing Type

Asynchronous

Max. Access Time (ns)

60

Maximum Erase Time (S)

113.6/Chip

Maximum Page Access Time (ns)

25

Maximum Programming Time (ms)

50400/Chip

OE Access Time (ns)

25

Process Technology

CMOS

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.7 to 3.6

Operating Current (mA)

55

Page Read Current (mA)

15

Program Current (mA)

30

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

No

ECC Support

No

Support of Page Mode

Yes

Mounting

Surface Mount

Package Height

0.58

Package Width

6

Package Length

8

PCB changed

48

Standard Package Name

BGA

Supplier Package

FBGA

Lead Shape

Ball

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

48

Architecture

Sectored

Sector Size

8Kbyte x 16|64Kbyte x 126

Page Size

8Words

Boot Block

Yes

Number of Banks

4