Samsung Semiconductor K6F1616U6C-FF70

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

48

Manufacturer Part Number

K6F1616U6C-FF70

Rohs Code

No

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

FBGA, BGA48,6X8,30

Risk Rank

5.92

Access Time-Max

70 ns

Number of Words

1048576 words

Number of Words Code

1000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA48,6X8,30

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Nom (Vsup)

3 V

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Terminal Pitch

The center distance from one pole to the next.

0.75 mm

Reach Compliance Code

unknown

JESD-30 Code

R-PBGA-B48

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

3 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ASYNCHRONOUS

Supply Current-Max

0.025 mA

Organization

1MX16

Output Characteristics

3-STATE

Memory Width

16

Standby Current-Max

0.000015 A

Memory Density

16777216 bit

Parallel/Serial

PARALLEL

I/O Type

COMMON

Memory IC Type

STANDARD SRAM

Standby Voltage-Min

1.5 V