Samsung Semiconductor K4H561638J-HIB3

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

60

Manufacturer Part Number

K4H561638J-HIB3

Rohs Code

Yes

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

BGA, BGA60,9X12,40/32

Risk Rank

5.84

Access Time-Max

0.7 ns

Clock Frequency-Max (fCLK)

167 MHz

Moisture Sensitivity Levels

1

Number of Words

16777216 words

Number of Words Code

16000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA60,9X12,40/32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY

Supply Voltage-Nom (Vsup)

2.5 V

Reflow Temperature-Max (s)

NOT SPECIFIED

JESD-609 Code

e3

Pbfree Code

Yes

Terminal Finish

MATTE TIN

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

225

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

unknown

JESD-30 Code

R-PBGA-B60

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

2.5 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Supply Current-Max

0.27 mA

Organization

16MX16

Output Characteristics

3-STATE

Memory Width

16

Standby Current-Max

0.003 A

Memory Density

268435456 bit

I/O Type

COMMON

Memory IC Type

DDR DRAM

Refresh Cycles

8192

Sequential Burst Length

2,4,8

Interleaved Burst Length

2,4,8