Samsung Electronics M470T5663EH3-CF7RA

ECCN (US)

4A994.a

Module

DRAM Module

Module Density

2Gbyte

Number of Chip per Module

16

Chip Density (bit)

1G

Data Bus Width (bit)

64

Max. Access Time (ns)

0.4

Maximum Clock Rate (MHz)

800

Chip Configuration

128Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Operating Current (mA)

1256

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Supplier Temperature Grade

Commercial

Module Sides

Double

ECC Support

No

Number of Ranks

Dual

Number of Chip Banks

8

CAS Latency

6

SPD EEPROM Support

Yes

Standard Package Name

DIM

Supplier Package

USODIMM

Mounting

Socket

Package Height

30

Package Length

67.6

Package Width

3.8(Max)

PCB changed

200

Lead Shape

No Lead

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

200

Organization

256Mx64

PLL

No

Self Refresh

Yes

Module Type

200SODIMM

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant