Samsung Electronics M393B2K70CM0-CF8

ECCN (US)

4A994.a

Module

DRAM Module

Module Density

16Gbyte

Number of Chip per Module

36

Chip Density (bit)

4G(DDP)

Data Bus Width (bit)

72

Max. Access Time (ns)

0.3

Maximum Clock Rate (MHz)

1066

Chip Configuration

1Gx4

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Operating Current (mA)

4734

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Module Sides

Double

ECC Support

Yes

Number of Ranks

Quad

Number of Chip Banks

8

CAS Latency

7

SPD EEPROM Support

Yes

Standard Package Name

DIMM

Supplier Package

RDIMM

Mounting

Socket

Package Height

30

Package Length

133.35

Package Width

4(Max)

PCB changed

240

Lead Shape

No Lead

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

240

Organization

2Gx72

PLL

No

Self Refresh

Yes

Module Type

240RDIMM

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant