Rochester Electronics, LLC MAX2373EGC+T

Mounting Type

Surface Mount

Package / Case

12-VFQFN Exposed Pad

Operating Temperature (Max.)

85°C

Operating Temperature (Min.)

-40°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

JESD-609 Code

e3

Pbfree Code

no

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Terminal Finish

TIN

Voltage - Supply

2.65V~3.3V

Construction

COMPONENT

Frequency

850MHz~940MHz

Test Frequency

a statistical procedure for assessing data that contain counts or the numbers of occurrences of various categories or classes.

850MHz~940MHz

Current - Supply

3.5mA

Gain

15.5dB

RF/Microwave Device Type

NARROW BAND LOW POWER

RF Type

The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

General Purpose

Input Power-Max (CW)

5dBm

Characteristic Impedance

50Ohm

Noise Figure

Noise figure (NF) and noise factor (F) are measures of degradation of the signal-to-noise ratio (SNR), caused by components in a signal chain.

1.8dB

P1dB

-19.5dBm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant