BGA622E6327
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44946930-BGA622E6327
RF Amp Chip Single GP 6GHz 4-Pin(3+Tab) SOT-343 T/R
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.
The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.
a statistical procedure for assessing data that contain counts or the numbers of occurrences of various categories or classes.
Noise figure (NF) and noise factor (F) are measures of degradation of the signal-to-noise ratio (SNR), caused by components in a signal chain.