Rochester Electronics LLC FDD6296

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Mounting Type

Through Hole

Package / Case

4-DIP (0.300", 7.62mm)

Supplier Device Package

4-DIP

Number of Terminals

2

Transistor Element Material

SILICON

Exterior Housing Material

1

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Part Package Code

TO-252

Package Description

DPAK-3

Drain Current-Max (ID)

15 A

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE

Series

WL-OCTR

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 100°C

JESD-609 Code

e3

Pbfree Code

Yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Terminal Finish

MATTE TIN

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Reach Compliance Code

unknown

Time@Peak Reflow Temperature-Max (s)

30

Pin Count

a count of all of the component leads (or pins)

3

JESD-30 Code

R-PSSO-G2

Qualification Status

An indicator of formal certification of qualifications.

COMMERCIAL

Approval Agency

CQC, cULus, cURus, UL, VDE

Voltage - Isolation

5000Vrms

Output Type

Triac

Configuration

SINGLE WITH BUILT-IN DIODE

Number of Channels

1

Contact Tail Size

10mA

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Voltage - Forward (Vf) (Typ)

1.24V

Case Connection

DRAIN

Transistor Application

SWITCHING

Polarity/Channel Type

N-CHANNEL

JEDEC-95 Code

TO-252

Drain-source On Resistance-Max

0.0088 Ω

Pulsed Drain Current-Max (IDM)

100 A

DS Breakdown Voltage-Min

30 V

Current - DC Forward (If) (Max)

60 mA

Avalanche Energy Rating (Eas)

165 mJ

FET Technology

METAL-OXIDE SEMICONDUCTOR

Number of Macro Cells

No

Current - Cathode

257µA (Typ)

Static dV/dt (Min)

1kV/µs

Delay Time - Propagation

400 V

Saturation Current

1