Rochester Electronics, LLC ADL5323ACPZ-WP

Mounting Type

Surface Mount

Package / Case

8-VFDFN Exposed Pad, CSP

Operating Temperature (Max.)

85°C

Operating Temperature (Min.)

-40°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

ADL5323

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Terminal Finish

MATTE TIN

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

WAFFLE PACK

Voltage - Supply

5V

Construction

COMPONENT

Frequency

1.7GHz~2.4GHz

Current - Supply

320mA

Gain

20dB

RF/Microwave Device Type

NARROW BAND MEDIUM POWER

RF Type

The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

Cellular, CDMA2000, W-CDMA, GSM

Input Power-Max (CW)

18dBm

Characteristic Impedance

50Ohm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant