Rochester Electronics 2N3819_Q

RoHS

Non-Compliant

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

350 mW

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Single

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

350 mW

Continuous Drain Current (ID)

50 mA

Gate to Source Voltage (Vgs)

-25 V

Drain to Source Breakdown Voltage

25 V