Renesas Electronics America Inc. V385AGLFT

Mounting Type

Surface Mount

Package / Case

56-TFSOP (0.240, 6.10mm Width)

Supplier Device Package

56-TSSOP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Driver

Voltage - Supply

3V~3.6V

Base Part Number

V385

Protocol

LVDS