Renesas Electronics America Inc. V385AGLF

Mounting Type

Surface Mount

Package / Case

56-TFSOP (0.240, 6.10mm Width)

Supplier Device Package

56-TSSOP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Driver

Voltage - Supply

3V~3.6V

Base Part Number

V385

Protocol

LVDS