4DB0226KA3AVG8

Renesas Electronics America Inc. 4DB0226KA3AVG8

Part No:

4DB0226KA3AVG8

Datasheet:

DDR4 Overview

Package:

53-TFBGA, FCCSPBGA

ROHS:

AINNX NO:

3422708-4DB0226KA3AVG8

Description:

IC DDR4 DATA BUFFER 53FCCCSP

Products specifications
  • Factory Lead Time
    12 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    53-TFBGA, FCCSPBGA
  • Usage Level
    Commercial grade
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Controller Type
    Dynamic RAM (DRAM)
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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