Renesas Electronics America Inc. 4DB0226KA3AVG

Factory Lead Time

12 Weeks

Mounting Type

Surface Mount

Package / Case

53-TFBGA, FCCSPBGA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Controller Type

Dynamic RAM (DRAM)

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant