HD64F7145F50V

Renesas Electronics America HD64F7145F50V

Part No:

HD64F7145F50V

Package:

144-LQFP

ROHS:

AINNX NO:

4815244-HD64F7145F50V

Description:

MCU 32-bit SuperH RISC 256KB Flash 3.3V 144-Pin LQFP

Products specifications
  • Factory Lead Time
    20 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    144-LQFP
  • Number of Pins
    144
  • Data Converters
    A/D 8x10b
  • Number of I/Os
    98
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -20°C~75°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    SuperH® SH7144
  • Published
    2008
  • JESD-609 Code
    e6
  • Pbfree Code
    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    144
  • Terminal Finish
    Tin/Bismuth (Sn/Bi)
  • Terminal Position
    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    3.3V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5mm
  • Frequency
    40MHz
  • Time@Peak Reflow Temperature-Max (s)
    20
  • Base Part Number
    HD64F7145
  • Pin Count

    a count of all of the component leads (or pins)

    144
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    3.3V
  • Interface
    EBI/EMI, I2C, SCI
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    256kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • Speed
    50 MHz
  • RAM Size
    8K x 8
  • Voltage - Supply (Vcc/Vdd)
    3V~3.6V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor
    SH-2
  • Peripherals
    DMA, POR, PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size
    32-Bit
  • Program Memory Size
    256KB 256K x 8
  • Connectivity
    EBI/EMI, I2C, SCI
  • Bit Size
    32
  • Access Time
    50 μs
  • Has ADC
    YES
  • DMA Channels
    YES
  • Data Bus Width
    32b
  • PWM Channels
    YES
  • DAC Channels
    NO
  • Number of Timers/Counters
    3
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    24
  • Length
    20mm
  • Height Seated (Max)
    1.7mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
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