Renesas Electronics America M3062LFGPFP#U3C

Factory Lead Time

20 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Copper, Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

100-BQFP

Number of Pins

100

Data Converters

A/D 26x10b; D/A 2x8b

Number of I/Os

85

ROM(word)

262144

Watchdog Timers

Yes

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C TA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

M16C™ M16C/60/62P

Published

2006

JESD-609 Code

e2

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

100

Terminal Finish

Tin/Copper (Sn/Cu)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 10 MHZ

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

300mW

Terminal Position

QUAD

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Supply Voltage

5V

Terminal Pitch

The center distance from one pole to the next.

0.65mm

Frequency

20MHz

Base Part Number

M3062

Pin Count

a count of all of the component leads (or pins)

100

Supply Voltage-Max (Vsup)

5.5V

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

3/5V

Supply Voltage-Min (Vsup)

3.3V

Interface

I2C, UART, USART

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

256kB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

Speed

24 MHz

RAM Size

20K x 8

Voltage - Supply (Vcc/Vdd)

2.7V~5.5V

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER

Core Processor

M16C/60

Peripherals

DMA, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

16-Bit

Program Memory Size

256KB 256K x 8

Connectivity

I2C, IEBus, UART/USART

Bit Size

16

Access Time

20 μs

Has ADC

YES

DMA Channels

YES

PWM Channels

YES

DAC Channels

YES

Number of Timers/Counters

11

Address Bus Width

A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

20

External Data Bus Width

16

Number of Programmable I/O

87

Length

20mm

Height Seated (Max)

3.05mm

Width

14mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free