Quest Technology International Inc. NFP-5001

Material

Acrylonitrile Butadiene Styrene (ABS)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

NFP

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Faceplate

Color

Black

Depth

0.240 6.10mm

Style

Single Gang

Length

4.858 123.40mm

Width

3.110 79.00mm

Material Flammability Rating

UL94 V-0

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant