Quest Technology International Inc. NFP-3005

Material

Acrylonitrile Butadiene Styrene (ABS)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

NFP

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Mounting Box

Color

White

Depth

1.889 48.00mm

Style

Single Gang

Port Direction

Straight

Length

4.528 115.00mm

Width

2.756 70.00mm

Material Flammability Rating

UL94 V-0