Qualcomm B39931B3868U410

Material

Aluminum

Shape

Square, Fins

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Material Finish

Blue Anodized

Series

pushPIN™

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Top Mount

Attachment Method

Push Pin

Height Off Base (Height of Fin)

0.984 (25.00mm)

Thermal Resistance @ Forced Air Flow

4.24°C/W @ 100 LFM

Thermal Resistance @ Natural

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Power Dissipation @ Temperature Rise

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Width

1.575 (40.00mm)

Length

1.575 (40.00mm)

Diameter

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