Qualcomm B39821B3836U410W9

Package / Case

QFN

Mounting Type

Surface Mount

Product Depth (mm)

5(mm)

Operating Temp Range

-40C to 85C

Mounting Styles

Surface Mount

Package

Tape & Reel (TR)

Mfr

Qualcomm (RF front-end (RFFE) filters)

Product Status

Obsolete

Frequency - Center

815.5MHz

Usage Level

Industrial grade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

-

Size / Dimension

0.118 L x 0.118 W (3.00mm x 3.00mm)

Applications

iDEN Systems

Pin Count

a count of all of the component leads (or pins)

4

Bandwidth

19MHz

Screening Level

Industrial

Insertion Loss

the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

2.7dB

Product Length (mm)

7(mm)

Height (Max)

0.043 (1.10mm)

Product Height (mm)

0.9(mm)