Pulse Electronics Network SFP0-3040-L

Factory Lead Time

11 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Contact Materials

COPPER ALLOY

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Published

2010

JESD-609 Code

e4

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Press-Fit

Connector Type

SFP

Number of Positions

40 (20 x 2)

MIL Conformance

NO

DIN Conformance

NO

IEC Conformance

NO

Filter Feature

NO

Mixed Contacts

NO

Option

GENERAL PURPOSE

Pitch

1.6mm

Total Number of Contacts

40

Orientation

Right Angle

Number of Positions Loaded

40

Reach Compliance Code

unknown

Contact Finish

Gold

Empty Shell

NO

Connector Style

Receptacle with Cage, Ganged (2x1)

Number of Ports

A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

2

Features

Board Guide, EMI Shielded, Light Pipe

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant