Pulse Electronics Network SFP018-L

Factory Lead Time

11 Weeks

Mounting Type

Through Hole, Right Angle

Contact Materials

COPPER ALLOY

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

JESD-609 Code

e4

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Press-Fit

Connector Type

SFP

Number of Positions

40 (20 x 2)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

2 PORTS 20 POSITIONS EACH

MIL Conformance

NO

DIN Conformance

NO

IEC Conformance

NO

Filter Feature

NO

Mixed Contacts

NO

Option

GENERAL PURPOSE

Total Number of Contacts

40

Contact Finish

Gold

Empty Shell

NO

Connector Style

Receptacle with Cage, Ganged (2x1)

Features

Board Guide, EMI Shielded, Light Pipe

Contact Finish Thickness

30.0μin 0.76μm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant