Phoenix Contact MDSTB 2.5/ 4-G1-5.08

Product Weight (g)

6.986

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8536.69.40.40

Automotive

No

PPAP

No

Termination Method

Solder

Terminal Pitch (mm)

5.08

Body Orientation

Right Angle

Maximum Current Rating (A)

10

Maximum Voltage Rating

320V

Insulation Resistance (MOhm)

5

Maximum Contact Resistance (MOhm)

2.1

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

100

Mating Cycle (Cycles)

25

Product Depth (mm)

22

Tail Length (mm)

3.5

Mounting

Through Hole

Pitch Spacing

5.08mm

Manufacturer Part Number

MDSTB2,5/4-G1-5,08

Manufacturer

Phoenix Contact

Part Life Cycle Code

Active

Ihs Manufacturer

PHOENIX CONTACT GMBH & CO KG

Risk Rank

5.73

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cardboard

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Shrouded Header (4/4 Sides)

Number of Rows

2

Gender

HDR

Reach Compliance Code

unknown

Number of Contacts

8

Terminal and Terminal Block Type

STRIP TERMINAL BLOCK

Rated Current

10A

Rated Voltage

320V

Product Length (mm)

22.32

Product Height (mm)

28.5