Phoenix Contact MSTB 2.5/4-GF-5.08

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin Over Nickel

Product Weight (g)

3

Mounting

Through Hole

Tail Length (mm)

3.5

Contact Plating Thickness

((3-5)/(1.3-3))um

Product Depth (mm)

12

Mating Cycle (Cycles)

25

Maximum Operating Temperature (°C)

100

Minimum Operating Temperature (°C)

-40

Maximum Contact Resistance (MOhm)

1.2

Insulation Resistance (MOhm)

5

Maximum Voltage Rating

320V

Maximum Current Rating (A)

12

Body Orientation

Right Angle

Terminal Pitch (mm)

5.08

Termination Method

Solder

PPAP

No

Automotive

No

ECCN (US)

EAR99

EU RoHS

Compliant

Voltage Rating Max

320V

Number of Contact Rows

1

Operating Temp Range

-40C to 100C

Mounting Styles

Through Hole

Contact Materials

Copper Alloy

Pitch (mm)

5.08(mm)

Pitch Spacing

5.08mm

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cardboard

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Shrouded Header (4 Sides)

Number of Rows

1

Gender

HDR

Number of Contacts

4

Housing Color

Green

Rated Current

12A

Current Rating (Max)

12(A)

Rated Voltage

320V

Product Length (mm)

30.48

Product Height (mm)

8.6