Phoenix Contact DFK-MC 1.5/ 4-GF-3.81

Product Weight (g)

3.4

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Termination Method

Solder Lug

Terminal Pitch (mm)

3.81

Body Orientation

Straight

Maximum Current Rating (A)

8

Maximum Voltage Rating

160V

Insulation Resistance (MOhm)

5

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

100

Product Depth (mm)

20.4

Mounting

Panel Mount

Pitch Spacing

3.81mm

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cardboard

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Wire to Board

Number of Rows

1

Gender

HDR

Number of Contacts

4

Rated Current

8A

Rated Voltage

160V

Product Length (mm)

29.63

Product Height (mm)

16.2