MSTBV 2.5/18-GF-5.08 BK

Phoenix Contact MSTBV 2.5/18-GF-5.08 BK

Part No:

MSTBV 2.5/18-GF-5.08 BK

Manufacturer:

Phoenix Contact

Datasheet:

-

Package:

-

AINNX NO:

31930227-MSTBV 2.5/18-GF-5.08 BK

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Automotive
    No
  • PPAP
    No
  • Termination Method
    Solder
  • Terminal Pitch (mm)
    5.08
  • Maximum Current Rating (A)
    12
  • Maximum Voltage Rating
    320V
  • Insulation Resistance (MOhm)
    5
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    100
  • Product Depth (mm)
    8.57
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Cardboard
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Type
    Shrouded Header (4 Sides)
  • Gender
    HDR
  • Number of Contacts
    18
  • Product Length (mm)
    101.6
  • Product Height (mm)
    12
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