Philips Semiconductors BSP250

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Exterior Housing Material

1

Rohs Code

Yes

Part Life Cycle Code

Transferred

Ihs Manufacturer

PHILIPS SEMICONDUCTORS

Package Description

,

Drain Current-Max (ID)

3 A

Operating Temperature-Max

150 °C

JESD-609 Code

e3

ECCN Code

EAR99

Terminal Finish

Matte Tin (Sn)

Reach Compliance Code

unknown

Configuration

SINGLE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Polarity/Channel Type

P-CHANNEL

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

1.65 W