Philips Semiconductors BCP56

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Exterior Housing Material

1

Rohs Code

Yes

Part Life Cycle Code

Transferred

Ihs Manufacturer

PHILIPS SEMICONDUCTORS

Operating Temperature-Max

150 °C

JESD-609 Code

e3

ECCN Code

EAR99

Terminal Finish

MATTE TIN

Peak Reflow Temperature (Cel)

260

Reach Compliance Code

unknown

Configuration

SINGLE

Polarity/Channel Type

NPN

Power Dissipation-Max (Abs)

1.5 W

Collector Current-Max (IC)

1 A

DC Current Gain-Min (hFE)

40