Philips Semiconductors BAS70-06W

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Material

synthetic polyolefin

Diameter of the protected wire (cable)

12.8…24 mm

Diameter before shrinking

26.0 mm

Diameter after shrinking

12.5 mm

Rohs Code

Yes

Part Life Cycle Code

Transferred

Ihs Manufacturer

PHILIPS SEMICONDUCTORS

Forward Voltage-Max (VF)

0.41 V

Operating Temperature-Max

150 °C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

in packs of 1 meter lengths

JESD-609 Code

e3

ECCN Code

EAR99

Type

Heat-shrink tube without adhesive layer

Terminal Finish

MATTE TIN

Color

red

Peak Reflow Temperature (Cel)

260

Reach Compliance Code

unknown

Diode Type

RECTIFIER DIODE

Output Current-Max

0.07 A

Rep Pk Reverse Voltage-Max

70 V

Non-rep Pk Forward Current-Max

0.1 A