Philips Semiconductors BAS32

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Material

synthetic polyolefin

Exterior Housing Material

1

Rohs Code

No

Part Life Cycle Code

Transferred

Ihs Manufacturer

PHILIPS SEMICONDUCTORS

Forward Voltage-Max (VF)

0.6 V

Operating Temperature-Max

200 °C

Diameter of protected wire (cable)

4.2…7.2 mm

Diameter before shrinkage

8.5 mm

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

in packs of 1 meter lengths

JESD-609 Code

e0

ECCN Code

EAR99

Type

Adhesive-free heat shrink tubing

Terminal Finish

Tin/Lead (Sn/Pb)

Color

green

Reach Compliance Code

unknown

Configuration

SINGLE

Diode Type

RECTIFIER DIODE

Output Current-Max

0.15 A

Number of Phases

1

Rep Pk Reverse Voltage-Max

75 V

Non-rep Pk Forward Current-Max

2 A