Panduit Corp HSEC2.0-5

Factory Lead Time

4 Weeks

Mount

Cable

Material

Polyolefin (PO), Semi-Rigid, Irradiated

Weight

299.370993g

Insulation Materials

Polyolefin

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

Pan-Shrink™ WET-SHRINK™ HSEC

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Type

Cap

Color

Black

Large Diameter Recovered

Recovered Diameter or maximum recovered diameter is the maximum inner diameter that the heat shrink will shrink down to. Even if the heat shrink mentioned above was slightly over the 1/4" supplied diameter it would shrink to at least the maximum recovered inner diameter specification when heated.

0.980 (24.89mm)

Large Diameter Supplied

2.252 (57.20mm)

Features

Adhesive Coating, Dust Tight, UV Resistant, Waterproof

Total Length Supplied

4.290 108.97mm

Length

139.7mm

Diameter - Inside

57.15 mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant