Panduit Corp HSEC1.0-X

Factory Lead Time

4 Weeks

Mount

Adhesive

Material

Polyolefin (PO), Semi-Rigid, Irradiated

Insulation Materials

Polyolefin

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

Pan-Shrink™ WET-SHRINK™ HSEC

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Type

Cap

Color

Black

Large Diameter Recovered

Recovered Diameter or maximum recovered diameter is the maximum inner diameter that the heat shrink will shrink down to. Even if the heat shrink mentioned above was slightly over the 1/4" supplied diameter it would shrink to at least the maximum recovered inner diameter specification when heated.

0.449 (11.40mm)

Large Diameter Supplied

1.150 (29.21mm)

Features

Adhesive Coating, Dust Tight, UV Resistant, Waterproof

Total Length Supplied

2.800 71.12mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant