Panasonic Electronic Components EHF-FD1812D

Package / Case

0805 (2012 Metric)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2002

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Applications

Cellular

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

HIGH ISOLATION

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

1.5W

Construction

COMPONENT

Reach Compliance Code

unknown

Frequency

880MHz~915MHz 1.71GHz~1.785GHz

Case Code (Metric)

2012

Case Code (Imperial)

0805

Power - Max

3.2W 1.5W

RF/Microwave Device Type

DIRECTIONAL COUPLER

Insertion Loss

the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

0.35dB, 0.45dB

Isolation

24dB, 17dB

Insertion Loss (dB)

0.45 dB

Coupler Type

Dual Band, Dual Path

Coupling Factor

Coupling Factor (CF) measures the coupling between classes excluding coupling due to inheritance. It is the ratio between the number of actually coupled pairs of classes in a scope (e.g., package) and the possible number of coupled pairs of classes. CF is primarily applicable to object-oriented systems.

19dB, 14dB

Length

2mm

Width

1.25mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant

Lead Free

Contains Lead