Panasonic Electronic Components EHF-2CM0900

Package / Case

0805 (2012 Metric)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2002

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Applications

Cellular

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

HIGH ISOLATION

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

3W

Construction

COMPONENT

Reach Compliance Code

unknown

Frequency

900MHz

Case Code (Metric)

2012

Case Code (Imperial)

0805

Power - Max

3W

RF/Microwave Device Type

DIRECTIONAL COUPLER

Isolation

25dB

Insertion Loss (dB)

0.3 dB

Coupler Type

Standard

Coupling Factor

Coupling Factor (CF) measures the coupling between classes excluding coupling due to inheritance. It is the ratio between the number of actually coupled pairs of classes in a scope (e.g., package) and the possible number of coupled pairs of classes. CF is primarily applicable to object-oriented systems.

14.5dB

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Lead Free