Panasonic Electronic Components EHF-FD1555

Package / Case

0606 (1616 Metric)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

2000

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

3W

Construction

COMPONENT

Reach Compliance Code

unknown

Frequency

800MHz

Power - Max

3W

RF/Microwave Device Type

DIRECTIONAL COUPLER

Isolation

28dB

VSWR-Max

1.3

Insertion Loss (dB)

0.2 dB

Input Power-Max (CW)

34.77dBm

Characteristic Impedance

50Ohm

Coupler Type

Standard

Coupling Factor

Coupling Factor (CF) measures the coupling between classes excluding coupling due to inheritance. It is the ratio between the number of actually coupled pairs of classes in a scope (e.g., package) and the possible number of coupled pairs of classes. CF is primarily applicable to object-oriented systems.

20 ± 2dB

Length

3.2mm

Width

1.6mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant

Lead Free

Contains Lead