Panasonic Electronic Components EHF-FD1506

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

2002

Size / Dimension

0.126Lx0.063W 3.20mmx1.60mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

ISOLATION-MIN (DB):18

Construction

COMPONENT

Reach Compliance Code

unknown

Frequency

1607Hz~1685MHz

Specifications

a measure of a material's ability to?conduct heat.?

Isolation (Min) 18dB, 1.6 VSWR (Max)

RF/Microwave Device Type

SPLITTER

VSWR-Max

1.7

Insertion Loss (dB)

4 dB

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Contains Lead