Panasonic Electronic Components EHF-FD1502

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

2002

Size / Dimension

0.126Lx0.063W 3.20mmx1.60mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

ISOLATION-MIN (DB):18

Construction

COMPONENT

Reach Compliance Code

unknown

Frequency

720Hz~760MHz

Specifications

a measure of a material's ability to?conduct heat.?

Isolation (Min) 18dB, 1.8 VSWR (Max)

RF/Microwave Device Type

SPLITTER

Insertion Loss

the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

4dB

VSWR-Max

1.9

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant

Lead Free

Contains Lead