OSRAM Opto Semiconductors, Inc. LW ETSG-AABB-JKPL-1-Z

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8541.40.20.00

Automotive

Unknown

PPAP

Unknown

Category

Chip LED

LED Material

GaN

Lens Shape Type

Circular

Lens Dimensions (mm)

2.4x2.4x0.9

Lens Appearance

Colored Diffused

Mounting Orientation

Top Mount

Intensity

2800mcd(Max)

Viewing Angle (°)

120

Maximum Forward Current (mA)

50

Test Current (mA)

30

Maximum Forward Voltage (V)

3.8

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

110

Lead Standoff

No

Supplier Color

White

High Power

No

High Brightness

Yes

Mounting

Surface Mount

Package Height

2.1(Max) - 0.1

Package Width

3.4(Max)

Package Length

3(Max)

PCB changed

4

Standard Package Name

LCC

Supplier Package

PLCC

Lead Shape

J-Lead

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

Uni-Color

Color

White

Pin Count

a count of all of the component leads (or pins)

4

Number of LEDs

1