OSRAM Opto Semiconductors, Inc. LBT66G-U1BA-59-SAMPLE

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Category

Chip LED

LED Material

InGaN

Lens Shape Type

Circular

Lens Dimensions (mm)

2.6x2.6x1.4

Lens Appearance

Colorless

Mounting Orientation

Top Mount

Intensity

2240mcd(Max)

Dominant Wavelength (nm)

470

Peak Wavelength (nm)

465

Viewing Angle (°)

55

Maximum Forward Current (mA)

50

Test Current (mA)

20

Maximum Forward Voltage (V)

3.7

Reverse Voltage (V)

5

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

100

Lead Standoff

No

Supplier Color

Blue

High Power

No

High Brightness

Yes

Mounting

Surface Mount

Package Height

3.8(Max) - 0.1

Package Width

3(Max)

Package Length

3.4(Max)

PCB changed

2

Standard Package Name

LCC

Supplier Package

PLCC

Lead Shape

J-Lead

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

Uni-Color

Color

Blue

Pin Count

a count of all of the component leads (or pins)

2

Luminous Flux

the measure of the perceived power of light.

2.02lm

Number of LEDs

1