Omron Electronics Inc-EMC Div XR2C-3200-HSG

Factory Lead Time

13 Weeks

Mounting Type

Through Hole

Number of Pins

32

Housing Material

Polybutylene Terephthalate (PBT), Glass Filled

Number of Positions or Pins (Grid)

32 (1 x 32)

Contact Material - Mating

Beryllium Copper

Contact Material - Post

Beryllium Copper

Published

2002

Series

XR2

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C~125°C

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Wire Wrap

Type

Housing

Current Rating (Amps)

1A

Pitch

2.54mm

Pitch - Mating

0.100 2.54mm

Contact Resistance

20mOhm

Termination Post Length

0.510 12.95mm

Pitch - Post

0.100 2.54mm

Features

Closed Frame

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Material Flammability Rating

UL94 V-0