Omron Electronics Inc-EMC Div XR2A-0825

Factory Lead Time

11 Weeks

Mounting Type

Through Hole

Mount

Through Hole

Housing Material

Polybutylene Terephthalate (PBT), Glass Filled

Number of Positions or Pins (Grid)

8 (2 x 4)

Contact Material - Mating

Beryllium Copper

Contact Material - Post

Beryllium Copper

Contact Finish Mating

Gold

Published

2002

Series

XR2

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C~125°C

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

ECCN Code

EAR99

Type

DIP, 0.3 (7.62mm) Row Spacing

Number of Rows

2

Gender

Female

Orientation

Straight

Pitch - Mating

0.100 2.54mm

Number of Contacts

8

Contact Resistance

20mOhm

Max Voltage Rating (AC)

300V

Max Current Rating

1A

Pitch - Post

0.100 2.54mm

Features

Open Frame

Contact Finish Thickness - Mating

Flash

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

Material Flammability Rating

UL94 V-0