HS300-TP2

Ohmite HS300-TP2

Part No:

HS300-TP2

Manufacturer:

Ohmite

Datasheet:

-

Package:

-

AINNX NO:

31670400-HS300-TP2

Description:

Thermal Interface Products HS300 RESISTOR THERMAL PAD

Products specifications
  • Material
    Ceramic Filled Silicone
  • Shape
    Rectangular
  • RoHS
    Details
  • Minimum Operating Temperature
    - 40 C
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 150 C
  • Factory Pack QuantityFactory Pack Quantity
    25
  • Dimensions
    127.7x72.5mm
  • Package
    Bulk
  • Mfr
    Ohmite
  • Product Status
    Active
  • Series
    HS-TP2
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Type
    Thermal Pad
  • Color
    Blue
  • Usage
    IGBT - Heat Transfer Low Thermal Resistance
  • Shelf Life
    -
  • Adhesive
    Tacky - Both Sides
  • Storage/Refrigeration Temperature
    -
  • Shelf Life Start
    -
  • Backing, Carrier
    -
  • Outline
    127.70mm x 72.50mm
  • Thermal Conductivity

    a measure of a material's ability to?conduct heat.?

    3 W/m-K
  • Product
    Thermally Conductive Gap Pad
  • Thermal Resistivity

    Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance.

    -
  • Length
    127.70 mm
  • Width
    72.50 mm
  • Diameter
    6.6mm
  • Thickness
    0.50 mm
  • Flammability Rating
    UL 94 V-0
0 Similar Products Remaining